ASML recently confirmed that the launch of the next generation Twinscan NXE lithography system is on schedule. This system is equipped with a 1000 watt EUV light source and can process up to 330 semiconductor wafers per hour.
This machine, expected to be launched in 2030 or later, will provide over 50% more power than the most advanced EUV systems currently available. It will help chip manufacturers significantly increase productivity and minimize the cost per semiconductor disk. However, to achieve this goal, ASML had to overcome a number of challenges and make significant technological advances.
Representatives from ASML’s technology team said that achieving one kilowatt of power was an extremely impressive achievement. The company even sees a clear development path towards 1,500 watts and is convinced that 2,000 watts is definitely achievable in the future.
In order to realize a 1000-watt EUV source within the next decade, ASML had to develop a completely new light generation process using three laser pulses. This method includes a first sub-pulse to flatten the tin droplets, a second sub-pulse to expand them, and finally a main laser pulse that converts the tin droplets into a plasma state to emit EUV light.
In addition, the new system will be equipped with an advanced tin droplet generator, doubling the operational capacity to 100,000 tin droplets per second.
However, increasing the number of tin droplets leads to increased abrasion. Therefore, the system requires a completely new abrasion container to ensure the absolute cleanliness of the semiconductor wafer surface.
Additionally, generating 1,000 watts of radiation is difficult, but transferring that energy to the semiconductor wafer is even more challenging. For this reason, ASML developed a completely new optical lens system with high light transmission that is intended to increase processing capacity to over 450 semiconductor wafers per hour.
A higher luminous efficiency also requires a comprehensive modernization of the assembly and movement systems for the semiconductor wafers.
This powerful light source requires next-generation photoresists and protective films. This means that not only ASML, but the entire chip industry ecosystem must prepare for the introduction of these new technologies.
ASML currently has detailed plans to integrate a 1000 watt light source into its product strategy. The next generation of lithography machines is expected to come onto the market gradually between 2027 and 2029.
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