MediaTek launches new mobile chip using TSMC's most advanced technology

The chip’s 2‑nanometer design is expected to deliver higher efficiency and speed, promising smoother multitasking and on‑device AI processing that rivals current flagship performance levels. Consumers anticipate longer battery life despite the power boost, reshaping daily mobile experiences. The breakthrough comes from MediaTek’s partnership with TSMC, which fabricated the chip on the foundry’s most advanced 2‑nanometer node.

Reuters reported the launch, and Seeking Alpha noted that the move positions MediaTek directly against Qualcomm in the high‑end segment. MediaTek’s own statement described the Dimensity 9600 Pro as setting a new standard for flagship smartphone chips. Technical details reveal a “2 + 3 + 3” CPU cluster, combining two efficiency cores, three performance cores and three ultra‑performance cores, LPDDR6 memory support and the ability to run local AI models with up to 30 billion parameters, according to Wccftech.

The chip will debut in Oppo’s Find X10 Pro Max, as indicated by Telecompaper. With these specifications, the industry now asks whether other OEMs will adopt the Dimensity 9600 Pro and how Qualcomm will respond to the new competition.