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SkyWater Technologies is emerging as a crucial player in the niche market for radiation-hardened (rad-hard) microchips. Traditionally known for custom chips and advanced semiconductor packaging, the company has recently secured significant state and federal funding. CEO Thomas Sonderman’s vision is ambitious: to transform SkyWater into a larger foundry specializing in rad-hard chips, while also positioning it as a trusted supplier for U.S. military and intelligence operations.
With the surge in applications such as unmanned aerial vehicles and commercial space launches, rad-hard electronics are becoming increasingly essential. Sonderman envisions SkyWater playing a pivotal role, much like Taiwan Semiconductor Manufacturing Company (TSMC) did for commercial chips. The goal is to separate design from manufacturing, aggregate demand at their fabrication facility, and establish SkyWater as a dominant force in this specialized sector.
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The Challenges of Radiation Hardening
Radiation hardening is a complex process aimed at making chips resilient to damage and functional in harsh environments, particularly those exposed to high levels of radiation. Conventional shielding can add weight, which is problematic for applications like space technology. Instead, advanced materials and manufacturing techniques are employed.
One common approach is the use of silicon on insulator (SOI) substrates. In this technique, a silicon film sits atop an insulating layer, typically silicon dioxide or sapphire. This arrangement minimizes parasitic capacitance and safeguards the active areas of transistors from radiation-induced charges, thereby increasing the chip’s durability.
A more advanced variant of SOI is fully depleted silicon on insulator (FDSOI), which has become the go-to method for creating rad-hard chips. This technology leverages the full thickness of the silicon layer, enabling more efficient and robust designs.
Domestic Defense Contractors and Their Fabs
Several major defense contractors manage their own fabrication facilities for rad-hard microelectronics. BAE Systems, a leading player in defense electronics, operates a dedicated facility in Nashua, New Hampshire. Thanks to a $35.5 million grant from the CHIPS Act, BAE Systems is modernizing its foundry to meet the growing demand for rad-hard chips.
Honeywell also offers a range of rad-hard chips, produced using advanced technologies from 0.8 to 0.15 micrometer geometries. The company provides both catalog products and custom foundry services. Last year, Honeywell received a $25.8 million award from the Department of Defense to develop a 90 nm process at its Plymouth, Minnesota, facility.
Other notable players include Sandia National Laboratories’ Microsystems Center and Northrop Grumman. Both organizations maintain their own specialized manufacturing capabilities to ensure access to high-quality rad-hard chips.
Bloomington-based SkyWater is another major player in this space. In December 2024, the company announced potential CHIPS funding of up to $16 million, paired with a state investment of $19 million. This funding will be used to modernize facilities and expand capacity. Additionally, SkyWater benefited from a $170 million defense department investment in 2019 aimed at enhancing its strategic microelectronics capabilities.
SkyWater’s Vision and Strategy
Thomas Sonderman believes the rad-hard market is ripe for consolidation. He argues that rather than maintaining their own small fabs and taking on execution risks with low utilization rates, defense contractors can benefit from a centralized foundry model. By pooling demand at SkyWater’s Bloomington facility, contractors can focus on design and product development, while SkyWater focuses on manufacturing.
SkyWater’s approach mirrors TSMC’s success in the commercial chip industry. Companies like Qualcomm and Nvidia have shifted their focus to design, relying on foundries for manufacturing. This strategy has led to significant cost savings and improved efficiency. Sonderman sees a similar opportunity in the rad-hard market, where demand is growing but remains fragmented.
One of SkyWater’s key differentiators is its 90 nm FDSOI technology platform, which supports various levels of hardening. This includes strategic rad-hard for extreme conditions, rad-hard for standard radiation resistance, and radiation-tolerant for less demanding applications.
Challenges remain, however. While there is a growing demand for rad-hard chips, the market volume is still much smaller compared to commercial chips. SkyWater must develop strategies to aggregate demand and achieve economies of scale. Sonderman is confident that SkyWater can lead the industry in this specialized field.
The Future of Rad-Hard Microchips
The future of rad-hard microchips is promising, driven by the increasing deployment of satellites and the expansion of military applications. As more systems operate in harsh environments, demand for these specialized chips will only grow. SkyWater’s transformation into a full-service rad-hard foundry positions the company to capitalize on this trend.
By focusing on design efficiency and competitive manufacturing, SkyWater aims to become a dominant player in the rad-hard market. This shift not only benefits SkyWater but also enhances national security by providing reliable and secure manufacturing capabilities.
As the space and defense industries continue to evolve, SkyWater’s strategy could redefine the landscape of rad-hard microelectronics. By leveraging advanced technologies and innovative business models, the company has the potential to establish itself as an indispensable partner for critical applications.
Conclusion
Thomas Sonderman’s vision for SkyWater Technologies is ambitious yet achievable. By mirroring the success of TSMC and focusing on efficiency and specialized capabilities, SkyWater can become a leading provider of rad-hard microchips. This shift not only benefits the company but also strengthens national security and supports the greater space and defense communities.
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