Major manufacturers of 3D NAND flash memory chips control the transition to a 96-layer layout. According to industry sources, this technology will be the most important next year. Memory with a large number of layers offers lower production costs and a greater amount of data storage, reducing the costs of finished products.
According to industry experts, 30% of the total 3D NAND memory production will fall on 96-layer chips in 2019 and in 2020 this figure will exceed 50%. Moreover, a trial introduction of 128-layer chips has already started. The most important competition between major chip manufacturers in the race for 128-layer 3D NAND production will begin in the coming quarters.
Moreover, sources report that the flash market remains oversaturated this year. Manufacturers are slowing down the pace of expanding their capacity and even lowering production to better manage inventory levels.
For example, Micron Technology has announced plans to further reduce its NAND flash memory capacity by 10%, while this year SK Hynix will produce 10% fewer semiconductor wafers compared to 2018. Meanwhile, Samsung Electronics is adjusting its production plans in the short term in response to the impact of trade disputes and restrictions between Japan and South Korea.